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Nanotechnology and MEMS/MST/Micromachines:
A Global Perspective on Technology, Applications and Commercialization |
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Monday June 9, 2008
8:30-5:45 p.m.
Donald Stephens
Conference Center, Rosemont Illinois
Session Organization and Chairman:
Roger H. Grace, Roger Grace Associates
AGENDA
| 8:30-8:35 |
Introduction and Welcome- R. Grace, Roger Grace
Associates |
| 8:35-9:05 |
MEMS Piezoresistive Sensors, A Successfully Invisible
Technology: Fifty Years and Counting (A.M. KEYNOTE) J.Mallon Jr., axept
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| 9:05-9:25 |
Critical Success Factors to the Successful Commercialization of
MEMS/MST: Lessons to be Learned by Nanotechnology, R.H. Grace, Roger Grace
Associates |
| 9:25-9:45 |
MEMS IR Temperature Sensing for Transportation and Health Care
Applications B. Wirth, GE Sensing |
| 9:45-10:05 |
How to Sustain the Expected TPMS (Tire Pressure Monitoring
System) Battery Life E. Caron, Freescale |
| 10:05-10:25 |
High Speed/High Resolution GMR Encoder Interface for Enhanced
Linear Displacement Measurement S. Graves, Visi-Trak Sensors |
| 10:25-10:35 |
Break |
| 10:35-10:55 |
Shaking Up the Wideband Vibration Market A. Champy, Analog
Devices |
| 10:55-11:15 |
High-G Impact Sensors for Hostile Environments T.
Christiansen, D. Elerath*, G. Smith; ht micro |
| 11:15-11:35 |
MEMS Magnetic Field Sensor for High Accuracy Applications
E. Berkcan*, S. Chandrasekaran, C. Kapusta, M. Aimi, G. Clayton; GE Global
Research |
| 11:35-11:55 |
Microfabricated Electrochemical Sensor for Gas Phase
Analytes I. Oh*, C. Monty, M. Shannon, R. Masel; University of Illinois at
Urbana-Champagne |
| 11:55-1:00 |
Lunch |
| 1:00-1:30 |
Nanomanufacturing Tools and Processes for Flexible Electronics
and Sensor Applications (P.M. KEYNOTE) J. Mead*(UMass Lowell), A. Busnaina
(Northeastern University), Carol Barry (UMassLowell), George Kachen (UMass
Lowell), G. Miller (UNew Hampshire), Nicol McGruer(Northeastern University), J.
Isaacs(Northeastern University) |
| 1:30-1:50 |
Diamond RF MEMS for Next Generation Mobile Wireless J.
Carlisle*, N. Maldovan, N. Kane; Advanced Diamond Technologies |
| 1:50-2:10 |
MEMS Strip Off Their Packages Heikki Kuisma, R.
Russell*;VTI Technologies |
| 2:10-2:30 |
Analog Signal Processing Gives micro-Watt Sensors milli-Watt
Brains H. Klein, GTronics |
| 2:30-2:50 |
Polymers for Permanent Wafer Bonding S., Farrens*, S. Sood;
Suss MicroTec |
| 2:50-3:10 |
Dynamic and Precise Current Measurement with Robust
Magnetoresistive Sensors R. Slater*, J. Achenbach; Sensitec GmbH |
| 3:10-3:30 |
Real-Time Three Dimensional MEMS Based Bio-Photonics Imaging
for Clinical Environments (INVITED) D. McCormick*(Advanced MEMS), W. Jung
(Beckman Laser Institute), Y.-C. Ahn (Beckman Laser Institute), Z. Chen
(Beckman Laser Institute), M. Brenner (Beckman Laser Institute) |
| 3:30-3:40 |
Break |
| 3:40-4:10 |
Remotely Powered, Hermetic RF MEMS Pressure Sensor E.
Andarawis, E. Berkcan*, B. Kashef; GE Global Research |
| 4:10-4:30 |
Ultra-Miniature, Wireless, Implantable Pressure Sensor Platform
for Medical Applications A. Cao*, C. Pisella;Tronics Microsystems |
| 4:30-4:50 |
Micro and Nano Sensors in Smart Textiles: Technology
Drivers and Applications, F. Ciontu, NanoSPRINT (INVITED) |
| 4:50-5:30 |
Panel: Manufacturing and Commercialization Challenges:
Successfully Transitioning the Product from the Lab to the Fab |
| Note: |
asterisk (*) denotes presenter |
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